VeriSilicon raises $20M more for chip design technology

VeriSilicon Holdings, a provider of a “system-on-a-chip” design technology, said it has raised US$20 million in a fourth round of financing.

The company is based in Santa Clara, Calif, with operations in Shanghai, China.

The company has now raised US$58 million since it was founded in 2001.

From the release:

This round was led by China Investment Fund (CIF), a business alliance between IBM and Lehman Brothers, and joined by VantagePoint Venture Partners and existing investors including Austin Ventures, Sierra Ventures, and CID. The company will use the funding to accelerate its research and development in SoC platforms using advanced semiconductor technology and expand its ASIC turnkey operations internationally. VeriSilicon currently has research and development centers in Santa Clara, California and Dallas, Texas, U. S.; Shanghai and Beijing, China; with sales and customer support offices in Santa Clara, California, US; Shanghai, Beijing, Shenzhen, China; Taipei, Taiwan; Tokyo, Japan; Nice, France; and Seoul, Korea.

“An innovative business model and innovative technology solutions have propelled VeriSilicon to the fore front of the emerging IC design foundry industry with a world wide customer base. The successful acquisition of ZSP division of LSI last year, together with the soft core license of ARM and PowerPC processors, facilitates our development of a variety of SoC platforms for consumer applications, such as multimedia, voice, and wireless communication. Application domain specific and star IP based SoC platforms are critical to making our business repeatable, scalable, and with high barrier of entry.”

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Tags: deal, Sierra Ventures