Direct2Silicon nabs $9M to lower cost of chip production
Direct2Silicon, the San Jose, Calif. maker of direct-write e-beam lithography software used to create system-on-a-chip integrated circuits, has filled out its second round of funding, now totaling $9 million. The money will go toward market development for its design-for-e-beam technology, which is said to save semiconductors substantial time and upfront mask costs.
This is great news for the ailing semiconductor industry. Mask budgets hover at $3 million for 40-nm chips, with makers pretty much required to… Continue Reading
System-on-a-chip software co. Direct2Silicon takes $7.2M
Direct2Silicon, a San Jose, Calif. company that makes direct-write e-beam lithography software to create system-on-a-chip integrated circuits, announced that it’s raised $7.19 million of an anticipated $9.48 million round of funding from investors including Benchmark Capital, Cadence Design Systems and Advantest, reports peHUB.
The company says its technology reduces the time it takes to design and manufacture these chips. Its past funding history, if any, has not been disclosed.
Tela closes $5.5M to scale semiconductor manufacturing
Tela Innovations, a Campbell, Calif. firm working to streamline semiconductor designs and manufacturing, has added three investors to close a $5.5 million third round of funding, reports VentureWire. The new backers, Cadence Design Systems, KT Venture Group and Qualcomm, join past contributors Intel Capital, AsiaTech Management, Sand Hill Finance, Teton Capital Group and Western Technology Investment.
The company plans to use the money to commercialize its semiconductor designs, aimed at efficiently scaling their processes.
CoWare, provider of EDA software, raises $7M of planned $14M
CoWare, a San Jose, Calif. provider of EDA software and services, has secured $7 million of a $14 million Series fifth round, according to a regulatory filing cited by PE Wire. Backers include Greylock Partners, GIMV, Cadence Design Systems and IT Partners (Belgium).