July 9-10, 2013
San Francisco, CA
San Francisco, CA
Neoconix, a provider of electrical interconnects for circuit boards that allows circuit boards to become smaller, has raised $16 million in a third round of financing.
The round was led by VentureTech Alliance, and included existing backers J.P. Morgan Partners, Venrock Associates, U.S. Venture Partners and Walden International.
The company has raised $39 million in venture backing since 2003. VentureWire (subscription required) first reported the news this morning.
